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SR806 Datasheet(PDF) 1 Page - Taiwan Semiconductor Company, Ltd |
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SR806 Datasheet(HTML) 1 Page - Taiwan Semiconductor Company, Ltd |
1 / 2 page Dimensions in inches and (millimeters) - 96 - Version: B07 SR802 - SR815 8.0 AMPS. Schottky Barrier Rectifiers DO-201AD Features Low power loss, high efficiency. High current capability, Low VF. High reliability High surge current capability. Epitaxial construction. Guard-ring for transient protection. For use in low voltage, high frequency inventor, free wheeling, and polarity protection application Mechanical Data Cases: DO-201AD molded plastic Epoxy: UL 94V-0 rate flame retardant Lead: Pure tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed Polarity: Color band denotes cathode High temperature soldering guaranteed: 260 oC/10 seconds/.375”,(9.5mm) lead lengths at 5 lbs., (2.3kg) tension Weight: 1.1 grams Maximum Ratings and Electrical Characteristics Rating at 25 oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Symbol SR 802 SR 803 SR 804 SR 805 SR 806 SR 809 SR 810 SR 815 Units Maximum Recurrent Peak Reverse Voltage VRRM 20 30 40 50 60 90 100 150 V Maximum RMS Voltage VRMS 14 21 28 35 42 63 70 105 V Maximum DC Blocking Voltage VDC 20 30 40 50 60 90 100 150 V Maximum Average Forward Rectified Current See Fig. 1 I(AV) 8.0 A Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) IFSM 150 A Maximum Instantaneous Forward Voltage @8.0A VF 0.55 0.70 0.92 1.02 V 0.5 0.1 Maximum D.C. Reverse Current @ TA=25 oC at Rated DC Blocking Voltage @ TA=125 oC IR 15 10 5.0 mA mA Typical Junction Capacitance (Note 2) C j 500 270 165 pF Typical Thermal Resistance (Note 1) RθJA 40 oC/W Operating Junction Temperature Range TJ -65 to +125 -65 to +150 oC Storage Temperature Range TSTG -65 to +150 oC Notes: 1. Mount on Cu-Pad Size 16mm x 16mm on P.C.B. 2. Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. |
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