TISP61CAP3

PROGRAMMABLE

OVERVOLTAGE PROTECTOR

4

SEPTEMBER 1994 - REVISED SEPTEMBER 1997

PRODUCT

INFORMATION

P008

plastic dual-in-line package

This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions The package is intended for

insertion in mounting-hole rows on 7,62 (0.300) centers. Once the leads are compressed and inserted,

sufficient tension is provided to secure the package in the board during soldering.

Leads require no

additional cleaning or processing when used in soldered assembly.

MECHANICAL DATA

1

2

3

4

8

7

6

5

10,2 (0.400) MAX

Index

Dot

1,78 (0.070) MAX

4 Places

5,08 (0.200)

MAX

0,51 (0.020)

MIN

2,54 (0.100) T.P.

6 Places

(see Note A)

0,533 (0.021)

0,381 (0.015)

8 Places

3,17 (0.125)

MIN

Seating

Plane

0,36 (0.014)

0,20 (0.008)

8 Places

105°

90°

8 Places

6,60 (0.260)

6,10 (0.240)

7,87 (0.310)

7,37 (0.290)

T.P.

C

L

C

L

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

P008

Designation per JEDEC Std 30:

PDIP-T8

NOTE A: Each pin centerline is located within 0,25 (0.010) of its true longitudinal position

MDXXABA