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FDG8842CZ Datasheet(PDF) 3 Page - Fairchild Semiconductor |
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FDG8842CZ Datasheet(HTML) 3 Page - Fairchild Semiconductor |
3 / 8 page www.fairchildsemi.com 3 ©2007 Fairchild Semiconductor Corporation FDG8842CZ Rev.B Electrical Characteristics T J = 25°C unless otherwise noted Drain-Source Diode Characteristics and Maximum Ratings Symbol Parameter Test Conditions Type Min Typ Max Units IS Maximum Continuous Drain-Source Diode Forward Current Q1 Q2 0.3 –0.3 A VSD Source to Drain Diode Forward Voltage VGS = 0V, IS = 0.3A (Note 2) VGS = 0V, IS = –0.3A (Note 2) Q1 Q2 0.76 –0.84 1.2 –1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθJA is determined by the user's board design. 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. a. 350°C/W when mounted on a 1 in2 pad of 2 oz copper . b. 415°C/W when mounted on a minimum pad of 2 oz copper. Scale 1:1 on letter size paper. |
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