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AMC2596-X.XPBF Datasheet(PDF) 9 Page - ADDtek Corp |
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AMC2596-X.XPBF Datasheet(HTML) 9 Page - ADDtek Corp |
9 / 12 page AMC2596 Copyright © 2006 ADDtek Corp. 9 DD008_A -- JUNE 2006 Heat Sink and Thermal Consideration Although the AMC2596 requires only a small heat sink for most cases, the following thermal consideration is important for all operation. With the package thermal resistances θJA and θJC, total power dissipation can be estimated as follows: PD = (VIN × IQ)+(VOUT / VIN)(ILOAD × VSAT); When no heat sink is used, the junction temperature rise can be determined by the following: ∆TJ = PD × θJA; With the ambient temperature, the actual junction temperature will be: TJ = ∆TJ +TA ; If the actual operating junction temperature is out of the safe operating junction temperature (typically 125°C), then a heat sink is required. When using a heat sink, the junction temperature rise will be reduced by the following: ∆TJ = PD × (θJC + θinterface + θHeat sink); As one can see from the above, it is important to choose an heat sink with adequate size and thermal resistance, such that to maintain the regulator’s junction temperature below the maximum operating temperature. |
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