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HSMA-C170 Datasheet(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED |
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HSMA-C170 Datasheet(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED |
8 / 11 page 8 Figure 8. Recommended Pb-free reflow soldering profile. Figure 9. Recommended soldering pattern for HSMx-C110. Figure 10. Recommended soldering pattern for HSMx-C170. Figure 11. Recommended soldering pattern for HSMx-C190 and C191. Figure 12. Recommended soldering pattern for HSMx-C150. 5.0 (0.200) 1.0 (0.039) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 0.9 (0.035) 0.2 (0.008) 0.9 (0.035) CENTERING BOARD 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 1.2 (0.047) 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 1.5 (0.059) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) Note: All dimensions in millimeters (inches). Figure 7. Recommended reflow soldering profile. 230°C MAX. 10 SEC. MAX. 4°C/SEC. MAX. OVER 2 MIN. TIME 4°C/SEC. MAX. 140-160°C –3°C/SEC. 217 °C 200 °C 60 - 120 SEC. 6 °C/SEC. MAX. 3 °C/SEC. MAX. 3 °C/SEC. MAX. 150 °C 255 - 260 °C 100 SEC. MAX. (Acc. to J-STD-020C) 10 - 30 SEC. TIME |
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Similar Description - HSMA-C170 |
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