10

Recommended Storage

Conditions

Storage Temp.

10˚C to 30˚C

Relative Humidity

Below 60% RH

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

three days if stored at the recom-

mended storage conditions.

Figure 10. Baking conditions chart.

Baking Conditions

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Packaging

Temp.

Time

In Reels

60˚C

≥ 48 hours

In Bulk

100˚C

≥ 4 hours

125˚C

≥ 2 hours

150˚C

≥ 1 hour

Baking should only be done once.

Moisture-Proof Packaging

All HSDL-3210 options are shipped in moisture-proof packaging. Once opened, moisture absorption begins.

This product is compliant to JEDEC level 4.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT

LESS THAN 30°C,

AND LESS THAN

60% RH

PACKAGE IS

OPENED LESS

THAN 72 HOURS

PERFORM RECOMMENDED

BAKING CONDITIONS

NO BAKING

IS NECESSARY

YES

NO

NO

YES