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HLMP-HD57 Datasheet(PDF) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-HD57 Datasheet(HTML) 6 Page - AVAGO TECHNOLOGIES LIMITED |
6 / 8 page 6 Ammo Packs Drawing 18.00 ± 0.50 (0.7087 ± 0.0197) 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) 9.125 ± 0.625 (0.3593 ± 0.025) 12.70 ± 0.30 (0.50 ± 0.0118) CATHODE 0.70 ± 0.20 (0.0276 ± 0.0079) 20.5 ± 1.00 (0.8071 ± 0.0394) A A VIEW A-A � 4.00 ± 0.20 (0.1575 ± 0.0079)TYP. ALL DIMENSIONS IN MILLIMETERS (INCHES). Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless of standoff or non-standoff. Example of Wave Soldering Temperature Profile for TH LED 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 TIME (MINUTES) PREHEAT TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. |
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