AD9245

Rev. D | Page 9 of 32

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

With Respect to

Min

Max

Unit

ELECTRICAL

AVDD

AGND

–0.3

+3.9

V

DRVDD

DGND

–0.3

+3.9

V

AGND

DGND

–0.3

+0.3

V

AVDD

DRVDD

–3.9

+3.9

V

D0 to D13

DGND

–0.3

DRVDD + 0.3

V

CLK, MODE

AGND

–0.3

AVDD + 0.3

V

VIN+, VIN–

AGND

–0.3

AVDD + 0.3

V

VREF

AGND

–0.3

AVDD + 0.3

V

SENSE

AGND

–0.3

AVDD + 0.3

V

REFT, REFB

AGND

–0.3

AVDD + 0.3

V

PDWN

AGND

–0.3

AVDD + 0.3

V

ENVIRONMENTAL

Storage Temperature Range

–65

+125

°C

Operating Temperature Range

–40

+85

°C

Lead Temperature

(Soldering 10 sec)

300

°C

Junction Temperature

150

°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

in still air, in accordance with EIA/JESD51-1.

Table 8. Thermal Resistance

Package Type

θ

JA

θ

JC

Unit

32-Lead LFCSP

32.5

32.71

°C/W

In addition, more metal directly in contact with the package

leads from metal traces, through holes, ground, and power

paddle be soldered to the ground plane for the LFCSP package.

There is an increased reliability of the solder joints, and

maximum thermal capability of the package is achieved with

the exposed paddle soldered to the customer board.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.