6

TN0604

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline

Doc.# DSFP-TN0604

A102507

20-Lead SOW (Wide Body) Package Outline (WG)

12.80x7.50mm body, 2.65mm height (max), 1.27mm pitch

Symbol

A

A1

A2

b

D

E

E1

e

h

L

L1

L2

θ

θ1

Dimension

(mm)

MIN

2.15

0.10

2.05

0.31

12.60

9.97

7.40

1.27

BSC

0.25

0.40

1.40

REF

0.25

BSC

NOM

----

12.80

10.30

7.50

--

--

MAX

2.65

0.30

2.55

0.51

13.00

10.63

7.60

0.75

1.27

JEDEC Registration MS-013, Variation AC, Issue E, Sep. 2005.

Drawings not to scale.

D

Seating

Plane

Gauge

Plane

L

L1

L2

Top View

Side View

View A-A

View B

View

B

θ1

θ

E1

E

A A2

A1

A

A

Seating

Plane

e

b

h

h

20

1

Note 1

Note 1

(Index Area

0.25D x 0.75E1)

Note 1:

This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either

a mold, or an embedded metal or marked feature.