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SN75976A2DGGR Datasheet(PDF) 1 Page - Texas Instruments |
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SN75976A2DGGR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 35 page SN75976A, SN55976A 9-CHANNEL DIFFERENTIAL TRANSCEIVER SLLS218B – MAY 1995 – REVISED MAY 1997 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Improved Speed and Package Replacement for the SN75LBC976 D Designed to Operate at up to 20 Million Data Transfers per Second (Fast-20 SCSI) D Nine Differential Channels for the Data and Control Paths of the Small Computer Systems Interface (SCSI) and Intelligent Peripheral Interface (IPI) D SN75976A Packaged in Shrink Small-Outline Package with 25-Mil Terminal Pitch (DL) and Thin Shrink Small-Outline Package with 20-Mil Terminal Pitch (DGG) D SN55976A Packaged in a 56-Pin Ceramic Flat Pack (WD) D Two Skew Limits Available D ESD Protection on Bus Terminals Exceeds 12 kV D Low Disabled Supply Current 8 mA Typ D Thermal Shutdown Protection D Positive- and Negative-Current Limiting D Power-Up/Down Glitch Protection description The SN75976A is an improved replacement for the industry’s first 9-channel RS-485 transceiver — the SN75LBC976. The A version offers improved switching performance, a smaller package, and higher ESD protection. The SN75976A is offered in two versions. The ’976A2 skew limits of 4 ns for the differential drivers and 5 ns for the differential receivers complies with the recommended skew budget of the Fast-20 SCSI standard for data transfer rates up to 20 million transfers per second. The ’976A1 supports the Fast SCSI skew budget for 10 million transfers per second. The skew limit ensures that the propagation delay times, not only from channel-to-channel but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel data buses. The patented thermal enhancements made to the 56-pin shrink small-outline package (SSOP) of the SN75976 have been applied to the new, thin shrink, small-outline package (TSSOP). The TSSOP package offers even less board area requirements than the SSOP while reducing the package height to 1 mm. This provides more board area and allows component mounting to both sides of the printed circuit boards for low-profile, space-restricted applications such as small form-factor hard disk drives. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Terminals 13 through 17 and 40 through 44 are connected together to the package lead frame and signal ground. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 GND BSR CRE 1A 1DE/RE 2A 2DE/RE 3A 3DE/RE 4A 4DE/RE VCC GND GND GND GND GND VCC 5A 5DE/RE 6A 6DE/RE 7A 7DE/RE 8A 8DE/RE 9A 9DE/RE CDE2 CDE1 CDE0 9B+ 9B– 8B+ 8B – 7B+ 7B – 6B+ 6B – VCC GND GND GND GND GND VCC 5B+ 5B – 4B+ 4B – 3B+ 3B – 2B+ 2B – 1B+ 1B – SN75976A DGG or DL SN55976A WD (TOP VIEW) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1997, Texas Instruments Incorporated |
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