Pad Assignment

Chip size: 92

´ 118 mil

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

Pad Coordinates

Unit: mil

Pad No.

X

Y

Pad No.

X

Y

1

-40.88

16.11

11

40.12

-48.32

2

-40.88

9.48

12

40.12

-39.74

3

-40.88

-11.56

13

40.12

-24.57

4

-40.88

-24.78

14

40.12

-15.98

5

-40.88

-34.04

15

40.12

-0.81

6

-40.88

-41.18

16

40.12

7.78

7

-13.77

-52.78

17

34.47

53.59

8

-7.14

-52.78

18

-8.97

53.59

9

9.22

-53.55

19

-15.60

53.59

10

24.40

-53.55

20

-22.23

52.02

HT6240-002

Rev. 1.30

2

November 6, 2002

1

1 1

2

1 2

3

1 3

4

1 4

5

1 5

6

1 6

7

1 7

8

1 8

9

1 9

1 0

2 0

P R B

O S C I

O S C O

D A T E

I E 0

I E 1

O . 5

O . 4

O . 3

O . 1

O . 2

O . 0

( 0 , 0 )