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HTG2150 Datasheet(PDF) 6 Page - Holtek Semiconductor Inc

Part # HTG2150
Description  8-Bit 320 Pixel Dot Matrix LCD MCU Series
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Manufacturer  HOLTEK [Holtek Semiconductor Inc]
Direct Link  http://www.holtek.com
Logo HOLTEK - Holtek Semiconductor Inc

HTG2150 Datasheet(HTML) 6 Page - Holtek Semiconductor Inc

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Absolute Maximum Ratings
Supply Voltage .........................................
-0.3V to 3.6V
Storage Temperature ............................
-50°Cto125°C
Input Voltage..............................VSS
-0.3V to VDD+0.3V
Operating Temperature...............................0
°Cto70°C
Note: These are stress ratings only. Stresses exceeding the range specified under
²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
D.C. Characteristics
Ta=25
°C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VDD
Conditions
VDD
Operating Voltage
¾¾
2.4
¾
3.6
V
IDD
Operating Current (RC OSC)
3V
No load, fSYS=4MHz
¾
12
mA
ISTB1
Standby Current With 7
mA LCD Bias Option
(RTC ON, LCD ON)
3V
No load,
HALT mode
¾¾
20
mA
ISTB2
Standby Current LCD Bias Off Option
(RTC OFF, LCD OFF)
3V
No load,
HALT mode
¾
0.5
1.5
mA
VIL1
Input Low Voltage for PA/PB
3V
¾
0
¾
0.9
V
VIH1
Input High Voltage for PA/PB
3V
¾
2.1
¾
3V
VIL2
Input Low Voltage (INT)3V
¾
0
¾
0.7
V
VIH2
Input High Voltage (INT)3V
¾
2.3
¾
3V
VIL3
Input Low Voltage (RES)3V
¾¾
1.5
¾
V
VIH3
Input High Voltage (RES)3V
¾¾
2.4
¾
V
IOH1
Port A, Port B Source Current
3V
VOH=2.7V
-1
-2
¾
mA
IOH2
Segment, Common Output Source Current
3V
VOH=2.7V
100
200
¾mA
IOH3
PWM1/PWM2 Source Current
3V
VOH=2.7V
-6
-8
¾
mA
IOL1
Port A, Port B Sink Current
3V
VOL=0.3V
1.5
4
¾
mA
IOL2
Segment, Common Output
Sink Current
3V
VOL=0.3V
250
500
¾mA
IOL3
PWM1/PWM2 Sink Current
3V
VOH=0.3V
810
¾
mA
RPH
Pull-high Resistance of PA/PB and INT
3V
¾
30
60
120
k
W
A.C. Characteristics
Ta=25
°C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VDD
Conditions
fSYS
System Clock (RC OSC)
3V
¾
400
¾
4000
kHz
2.4V
¾
400
¾
4000
tRES
External Reset Low Pulse Width
¾¾
1
¾¾
ms
tSST
System Start-up Timer Period
¾
Power-up or
Wake-up from HALT
¾
1024
¾
tSYS
tINT
Interrupt Pulse Width
¾¾
1
¾¾
ms
Note: tSYS=1/fSYS
HTG2150
Rev. 1.30
6
May 21, 2002


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