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CM150TJ-12F Datasheet(PDF) 3 Page - Powerex Power Semiconductors

Part # CM150TJ-12F
Description  Trench Gate Design Six IGBTMOD??150 Amperes/600 Volts
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Manufacturer  POWEREX [Powerex Power Semiconductors]
Direct Link  http://www.pwrx.com
Logo POWEREX - Powerex Power Semiconductors

CM150TJ-12F Datasheet(HTML) 3 Page - Powerex Power Semiconductors

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CM150TJ-12F
Trench Gate Design Six IGBTMOD™
150 Amperes/600 Volts
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Input Capacitance
Cies
––
41
nf
Output Capacitance
Coes
VCE = 10V, VGE = 0V, f = 1MHz
2.7
nf
Reverse Transfer Capacitance
Cres
––
1.5
nf
Inductive
Turn-on Delay Time
td(on)
VCC = 300V,
120
ns
Load
Rise Time
tr
IC = 150A,
100
ns
Switch
Turn-off Delay Time
td(off)
VGE1 = VGE2 = 15V,
350
ns
Times
Fall Time
tf
RG = 4.2 ,–
250
ns
Diode Reverse Recovery Time**
trr
Inductive Load
150
ns
Diode Reverse Recovery Charge**
Qrr
Switching Operation
2.8
µC
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Thermal Resistance, Junction to Case
Rth(j-c)QPer IGBT 1/6 Module, Tc Reference
0.31
°C/W
Point per Outline Drawing
Thermal Resistance, Junction to Case
Rth(j-c)DPer FWDi 1/6 Module, Tc Reference
0.47
°C/W
Point per Outline drawing
Thermal Resistance, Junction to Case
Rth(j-c)'Q
Per IGBT 1/6 Module,
0.19
°C/W
Tc Reference Point Under Chip
Thermal Resistance, Junction to Case
Rth(j-c)'D
Per FWDi 1/6 Module, Tc Reference
0.25
°C/W
Tc Reference Point Under Chip
Contact Thermal Resistance
Rth(c-f)
Per Module, Thermal Grease Applied
0.13
°C/W
** Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).


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