Chip Information

TRANSISTOR COUNT: 1200

PROCESS: Bipolar (SiGe)

17

18

19

20

21

22

23

DOA1-

DOA1+

DOA0-

DOA0+

8

7

6

5

4

3

2

SELB1

NOTE: THE EXPOSED PAD MUST BE SOLDERED

TO THE SUPPLY GROUND.

DIB0-

DIB0+

SELB0

ENB0

DIB1-

DIB1+

MAX3840

QFN

1

ENB1

24

GND

TOP VIEW

Pin Configurations

32

31

30

29

28

27

26

ENA1

DIA1-

DIA1+

ENA0

SELA0

DIA0-

DIA0+

25

SELA1

9

10

11

12

13

14

15

GND

DOB0-

DOB0+

DOB1-

DOB1+

16

17

18

19

20

21

22

23

8

7

6

5

4

3

2

NOTE: THE EXPOSED PAD MUST BE SOLDERED

TO THE SUPPLY GROUND.

MAX3840

THIN QFN

1

24

TOP VIEW

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

© 2007 Maxim Integrated Products

is a registered trademark of Maxim Integrated Products, Inc.

Package Information

For the latest package outline information, go to

PACKAGE TYPE

DOCUMENT NO.

32 QFN

21-0091

32 TQFN

21-0140

Revision History

Rev 1; 11/01:

Corrected specification.

Rev 2; 5/03:

Added package code (page 1); updated package drawing (page 10).

Rev 3; 5/05:

Added lead-free package (pages 1, 2, 8, 11, 12).

Rev 4; 12/05:

Rev 5; 9/07:

Added two AC amplitude specifications to increase test coverage for 2.5Gbps and 2.7GHz

clock inputs (page 3); removed package drawings and added package table (page 8).