IRS2308(S)PbF

www.irf.com

2

Symbol

Definition

Min.

Max.

Units

High-side floating absolute voltage

-0.3

625

High-side floating supply offset voltage

High-side floating output voltage

Low-side and logic fixed supply voltage

-0.3

25

Low-side output voltage

-0.3

Logic input voltage (HIN & LIN )

Allowable offset supply voltage transient

—

50

V/ns

(8 lead PDIP)

—

1.0

(8 lead SOIC)

—

0.625

Thermal resistance, junction to ambient

(8 lead PDIP)

—

125

(8 lead SOIC)

—

200

Junction temperature

—

150

Storage temperature

-50

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

DT97-3 for more details).

V

°C

°C/W

W

Recommended Operating Conditions

The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the

High-side floating supply absolute voltage

High-side floating supply offset voltage

Note 1

600

High-side floating output voltage

Low-side and logic fixed supply voltage

10

20

Low-side output voltage

0

Logic input voltage

COM

Ambient temperature

-40

125

V

Symbol

Definition

Min.

Max.

Units

°C