SM5022 series

SEIKO NPC CORPORATION —2

PAD LAYOUT

(Unit:

µm)

PINOUT

(Top view)

PIN DESCRIPTION and PAD DIMENSIONS

Chip size

: 1.00

× 0.80mm

Chip thickness : 220 ± 30µm

Chip base

Q

VDD

XT

VSS

(0,0)

(1000,800)

INHN

XTN

Version

Product ID

SM5022A1AH

A00

SM5022A2AH

A01

SM5022A3AH

A02

SM5022A4AH

A03

SM5022A5AH

A04

SM5022A7AH

A05

SM5022B1AH

A06

1

XT

VSS

Q

VDD

2

3

6

5

4

XTN

INHN

Number

Name

I/O

Description

Pad dimensions [µm]

XY

1

INHN

I

Output state control input. High impedance when LOW. Pull-up resistor built in

834

217

2

XT

I

Amplifier input.

Crystal oscillator connection pins.

Crystal oscillator is connected between XT and XTN

637

217

3

VSS

–

Ground

165

165

4

Q

O

162

637

5

VDD

–

Supply voltage

859

450

6

XTN

O

Amplifier output.

Crystal oscillator connection pins.

Crystal oscillator is connected between XT and XTN

804

604