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TPS853 Datasheet(PDF) 5 Page - Toshiba Semiconductor |
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TPS853 Datasheet(HTML) 5 Page - Toshiba Semiconductor |
5 / 12 page TPS853 2005-07-21 5 (2) Recommended soldering pattern (3) Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50°C × 30 s or 30°C × 3 minutes Ultrasonic cleaning: 300 W or less Packing Specification (1) Packing quantity Reel (minimum packing quantity) 3,000 devices Carton 5 reels (15,000 devices) (2) Packing format An aluminum envelope containing silica gel and reels is deaerated and sealed. Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them. • Carton specification Carton dimensions (W) 81 mm × (L) 280 mm × (H) 280 mm Label 0.65 0.65 0.4 Unit: mm |
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