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TLP592G Datasheet(PDF) 2 Page - Toshiba Semiconductor

Part # TLP592G
Description  Telecommunications
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP592G Datasheet(HTML) 2 Page - Toshiba Semiconductor

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TLP592G
2007-10-01
2
Absolute Maximum Rating (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Forward current
IF
50
mA
Forward current derating
(Ta >= 25°C)
ΔIF/°C
−0.5
mA/°C
Peak forward current
(100
μs pulse, 100 pps)
IFP
1
A
Reverse voltage
VR
5
V
LED
Junction temperature
Tj
125
°C
Off-state output terminal voltage
VOFF
350
V
A connection
120
B connection
120
On-state current
C connection
ION
240
mA
A connection
−1.2
B connection
−1.2
On-state current
derating (Ta >= 25°C)
C connection
ΔION/°C
−2.4
mA/°C
Detector
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
−55~125
°C
Operating temperature range
Topr
−40~85
°C
Lead soldering temperature (10 s)
Tsol
260
°C
Isolation voltage (AC, 1 min, R.H. <= 60%)
(Note 1)
BVS
2500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device: LED side pins shorted together, and detector side pins shorted
together.
Recommended Operating Conditions
Characteristics
Symbol
Min
Typ.
Max
Unit
Supply voltage
VDD
280
V
Forward current
IF
5
7.5
25
mA
On-state current
ION
100
mA
Operating temperature
Topr
−20
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Circuit Connections
A Connection
B Connection
C Connection
1
2
3
6
5
4
LOAD
AC
or
DC
1
2
3
6
5
4
LOAD
DC
1
2
3
6
5
4
LOAD
DC


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