175V/2A, High-Speed,

Half-Bridge MOSFET Drivers

2

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND, unless otherwise noted.)

HS............................................................................-5V to +180V

BST to HS ...............................................................-0.3V to +14V

dV/dt at HS ........................................................................50V/ns

8-Pin SO (derate 5.9mW/°C above +70°C)...............470.6mW

8-Pin SO-EP (derate 19.2mW/°C above +70°C) .....1538.5mW

8-Pin SO .......................................................................40°C/W

8-Pin SO-EP....................................................................6°C/W

8-Pin SO .....................................................................170°C/W

8-Pin SO-EP..................................................................52°C/W

Maximum Junction Temperature .....................................+150°C

Operating Temperature Range .........................-40°C to +125°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLIES

Operating Supply Voltage

(Notes 3 and 4)

8.0

12.6

V

(No Switching)

IN_H = IN_L = GND (for A/C versions),

70

140

µA

3

mA

BST Quiescent Supply Current

IN_H = IN_L = GND (for A/C versions),

15

40

µA

BST Operating Supply Current

3

mA

6.5

7.3

8.0

V

UVLO (BST to HS)

BST rising

6.0

6.9

7.8

V

UVLO Hysteresis

0.5

V

LOGIC INPUT

0.67 x

0.55 x

Input-Logic High

MAX15013_, TTL version

2

1.65

V

0.4 x

0.33 x

Input-Logic Low

MAX15013_, TTL version

1.4

0.8

V

1.6

Logic-Input Hysteresis

MAX15013_, TTL version

0.25

V

*Per JEDEC 51 Standard Multilayer board.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JE5D51-7, using a four-

layer board. For detailed information on package thermal considerations, see www.maxim-ic.com/thermal-tutorial.