TA48015,018,025,033,05,08,09BF

2007-06-25

2

Block Diagram

Characteristic

Symbol

Rating

Unit

Input voltage

16

V

Output current

1

A

Operating junction temperature

-40~150

°C

Junction temperature

150

°C

Storage temperature

−55~150

°C

Ta

= 25°C

1

Power dissipation

Tc

= 25°C

10

W

Note 1: Do not apply external current and voltage (including negative voltage) to non-specified pins.

Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly

even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute

maximum ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Thermal Characteristics

Characteristic

Symbol

Max

Unit

Thermal resistance, junction to ambient

125

℃

/ W

Thermal resistance, junction to case

12.5

℃

/ W

Protection Function (reference)

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

Thermal shutdown

150

175

⎯

°C

Thermal shutdown hysteresis width

4.3 V (033BF) / 6.0 V (05BF) /

9.0 V (08BF) / 10.0 V (09BF)

⎯

20

⎯

°C

⎯

1.7

⎯

Peak circuit current

⎯

1.8

⎯

A

⎯

1.2

⎯

Short circuit current

⎯

1.3

⎯

A

Note 3: Ensure that the devices operate within the limits of the maximum rating when in actual use.

1

IN

Over current

protection

2

OUT

3

GND

Thermal

shutdown circuit

Reference

voltage circuit

Constant

current circuit