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RECOMMENDED OPERATING CONDITIONS

DISSIPATION RATINGS

TLC5943

SBVS101 – DECEMBER 2007

TLC5943

PARAMETER

TEST CONDITIONS

MIN

NOM

MAX

UNIT

Supply voltage

3.0

5.5

V

Voltage applied to output

OUT0 to OUT15

17

V

High-level input voltage

0.7

× V

CC

V

Low-level input voltage

GND

0.3

× V

CC

V

High-level output current

SOUT

–1

mA

SOUT

1

mA

Low-level output current

XERR

5

mA

Constant output sink current

OUT0 to OUT15

50

mA

Operating free-air temperature

–40

+85

°C

Operating junction

–40

+125

°C

temperature

Data shift clock frequency

SCLK

30

MHz

Grayscale control clock

GSCLK

33

MHz

frequency

SCLK, GSCLK

10

ns

Pulse duration

XLAT, BLANK

30

ns

SIN–SCLK

↑

6

ns

XLAT

↑–SCLK↑

100

ns

BLANK

↓–GSCLK↑

10

ns

Setup time

BCSEL–SCLK

↑

10

ns

BCSEL–XLAT

↑

30

ns

XLAT

↓–SCLK↑

15

ns

XLAT

↑–BLANK↓

20

ns

SIN–SCLK

↑

3

ns

XLAT

↑–SCLK↑

30

ns

Hold time

BCSEL–SCLK

↓

10

ns

BCSEL–XLAT

↑

100

ns

OPERATING FACTOR

PACKAGE

POWER RATING

POWER RATING

POWER RATING

HTSSOP-28 with

31.67 mW/

°C

3958 mW

2533 mW

2058 mW

HTSSOP-28 with

16.21 mW/

°C

2026 mW

1296 mW

1053 mW

27.86 mW/

°C

3482 mW

2228 mW

1811 mW

(1)

With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available

for download at www.ti.com).

(2)

With PowerPAD not soldered onto copper area on PCB.

(3)

The package thermal impedance is calculated in accordance with JESD51-5.

Copyright © 2007, Texas Instruments Incorporated

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