TLP114A

2007-10-01

2

Characteristic

Symbol

Rating

Unit

Forward current

(Note 1)

20

mA

Pulse forward current

(Note 2)

40

mA

Peak transient forward current

(Note 3)

1

A

Reverse voltage

5

V

Output current

8

mA

Peak output current

16

mA

Supply voltage

−0.5~30

V

Output voltage

−0.5~20

V

Output power dissipation

(Note 4)

100

mW

Operating temperature range

−55~100

°C

Storage temperature range

−55~125

°C

Lead solder temperature(10 sec.)

260

°C

Isolation Voltage

(AC,1 min., R.H.≤ 60°%)

(Note 5)

3750

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

(Note 1) Derate 0.36mA / °C above 70°C.

(Note 2) 50% duty cycle, Ims pulse width.

Derate 0.72mA / °C above 70°C.

(Note 3) Pulse width≤ 1μs, 300pps.

(Note 4) Derate 1.8mW / °C above 70°C.