2/7

/ INH

Q0

‘H’ or Open

Clock Output

‘L’

High Impedance

DESIGNATOR

DESCRIPTION

SYMBOL

DESCRIPTION

①

Duty Level

C

: CMOS

②

Fixed Number

2

: -

1

: f0/1

2

: f0/2

4

: f0/4

③

Divider Ratio

8

: f0/8

A

: 8MHz ~ 70MHz

④

Oscillation Frequency

B

: 16MHz ~ 120MHz

C

: Chip form

⑤

Chip Form & Package Type

M

: SOT-26 package

T

: Chip tray

R

: Embossed tape, standard feed

L

: Embossed tape, reverse feed

⑥

Device Orientation

W

: Wafer

PAD DIMENSIONS

PIN

NUMBER

PIN

NAME

FUNCTION

X

Y

1

/ INH

Stand-by Control*

- 236

- 436

2

XT

Crystal Oscillation

Connection (Input)

- 79

- 436

3

/ XT

Crystal Oscillation

Connection (Output)

79

- 436

4

Ground

236

- 436

5

Q0

Clock Output

236

436

6

(NC)

No Connection

- 78

436

7

Power Supply

- 236

436

* Pull-up resistor is built-in to the stand-by control pin.

■

PRODUCT CLASSIFICATION

●

Ordering Information

XC2165 ①②③④⑤⑥

■

/ INH, Q0 PIN FUNCTION

■

PAD LAYOUT

Size (Chip)

Thickness (Chip)

Backside (Chip)

Aperture (Pad)

: 800×1200μm

: 200±20μm

: GND level

: 90×90μm

■

PAD DIMENSIONS

■

BLOCK DIAGRAM

VDD

XT

INH

XT

Cg

Cd

Rf

Rup

Q0

VSS

1/2

1/2

1/2

Unit:μm