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TLV1112IKTPR Datasheet(PDF) 2 Page - STMicroelectronics |
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TLV1112IKTPR Datasheet(HTML) 2 Page - STMicroelectronics |
2 / 12 page TLV1112 1.2V, 0.8A LOW DROPOUT VOLTAGE REGULATOR SLVS562B – DECEMBER 2004 – REVISED APRIL 2005 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description/ordering information (continued) The low-profile surface-mount KTP package allows the device to be used in applications where space is limited. The TLV1112 requires a minimum of 10 mF of output capacitance for stability. Output capacitors of this size or larger normally are included in most regulator designs. Unlike pnp-type regulators, where up to 10% of the output current is wasted as quiescent current, the quiescent current of the TLV1112 flows into the load, increasing efficiency. The TLV1112C is characterized for operation over the virtual junction temperature range of 0 °C to 125°C. The TLV1112I is characterized for operation over the virtual junction temperature range of − 40 °C to 125°C. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Continuous input voltage 20 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating virtual junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. package thermal data (see Note 1) PACKAGE BOARD θJP‡ θJC θJA PowerFLEX t/TO-252 (KTP) High K, JESD 51-5 1.4 °C/W 19 °C/W 28 °C/W SOT (DCY) High K, JESD 51-7 4 °C/W 53 °C/W TO-220 (KCS) High K, JESD 51-5 3 °C/W 17 °C/W 19 °C/W TO-263 (KTT) High K, JESD 51-5 TBD TBD NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. ‡ For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, θJP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. recommended operating conditions MIN MAX UNIT VIN Input voltage 2.7 15 V IOUT Output current 800 mA TJ Operating virtual junction temperature range TLV1112I −40 125 °C TJ Operating virtual junction temperature range TLV1112C 0 125 °C |
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