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EMIF02-600FU7 Datasheet(PDF) 8 Page - STMicroelectronics |
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EMIF02-600FU7 Datasheet(HTML) 8 Page - STMicroelectronics |
8 / 9 page PACKAGE MECHANICAL DATA SSOP24 RECOMMENDED FOOTPRINT 0.65mm 8.3mm 5.3mm 0.45mm 13 12 24 1 D F b e A a1 S b1 E L REF. DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 1.73 1.86 2.00 0.068 0.073 0.079 a1 0.05 0.25 0.002 0.010 b 0.25 0.35 0.010 0.014 b1 0.10 0.35 0.0035 0.014 D 8.07 8.20 8.33 0.317 0.322 0.328 E 7.60 7.90 0.299 0.311 e 0.65 0.0256 F 5.20 5.38 0.2047 0.2118 L 0.25 0.88 0.010 0.0347 S8 °max Mechanical specifications Lead plating Tin-lead Lead plating thickness 7 µm min. 20 µm max. Lead material Copper alloy Lead coplanarity 0.08mm max. Body material Molded epoxy Flammability UL94V-0 EMIF02-600FU7 8/9 |
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