Technical Data Sheet

3474/GADB-AMPA/X/MS

Everlight Electronics Co., Ltd.

http\\:www.everlight.com

Rev 1

Page: 6 of 6

Device Number : DLE-347-007

Prepared date: 02-09-2006

Prepared by: Grace Shen

Notes

1. Above specification may be changed without notice. EVERLIGHT will reserve authority on

material change for above specification.

2. When using this product, please observe the absolute maximum ratings and the instructions for

using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any

damage resulting from use of the product which does not comply with the absolute maximum

ratings and the instructions included in these specification sheets.

3. These specification sheets include materials protected under copyright of EVERLIGHT

corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s

consent.

4. Soldering Condition

Careful attention should be paid during soldering. When soldering, leave more then 3mm

from solder joint to case, and soldering beyond the base of the tie bar is recommended.

Avoiding applying any stress to the lead frame while the LEDs are at high temperature

particularly when soldering.

Recommended soldering conditions:

Hand Soldering

DIP Soldering

Temp. at tip of iron

400

Max.

℃

(30W

Max.)

Preheat temp.

100

Max.

℃

(60 sec Max.)

Soldering time

3 sec Max.

Bath temp.

265 Max.

Distance

3mm Min.(From solder

joint to case)

Bath time.

5 sec Max.

Distance

3mm Min.

EVERLIGHT ELECTRONICS CO., LTD.

Tel: 886-2-2267-2000, 2267-9936

Office: No 25, Lane 76, Sec 3, Chung Yang Rd,

Fax: 886-2267-6244, 2267-6189, 2267-6306

Tucheng, Taipei 236, Taiwan, R.O.C

http:\\www.everlight.com