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FMA3008 Datasheet(PDF) 2 Page - Filtronic Compound Semiconductors |
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FMA3008 Datasheet(HTML) 2 Page - Filtronic Compound Semiconductors |
2 / 8 page Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com 2 Production Datasheet v2.9 FMA3008 ABSOLUTE MAXIMUM RATINGS: Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the device. PAD LAYOUT: PARAMETER SYMBOL ABSOLUTE MAXIMUM Max Input Power Pin +20dBm Gate Voltage VG1 -2V Drain Voltage VDD +10V Total Power Dissipation Ptot tbd Gain Compression Comp tbd Thermal Resistivity θ JC 38°C/W Operating Temp Toper -40°C to +85°C Storage Temp Tstor -55°C to +150°C Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of bond pad opening PAD REF PAD NAME DESCRIPTION PIN COORDINATES (µm) A RF in RF in (105,713) B GND Ground (198, 126) C VG Gate Voltage (461, 128) D Out RF Output (663, 713) E GND Ground (2170, 1580) F VD Drain Voltage (1998, 1580) E F D A C B DIE SIZE ( µm) DIE THICKNESS ( µm) MIN. BOND PAD PITCH ( µm) MIN. BOND PAD OPENING ( µm x µm ) 2350 x 1710 100 179 100 x 100 Website: www.filtronic.com |
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