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FMA219 Datasheet(PDF) 5 Page - Filtronic Compound Semiconductors |
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FMA219 Datasheet(HTML) 5 Page - Filtronic Compound Semiconductors |
5 / 5 page Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filtronic.com 5 Datasheet v3.0 FMA219 RECOMMENDED ASSEMBLY SCHEMATIC: PREFERRED ASSEMBLY INSTRUCTIONS: GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is metallised and the recommended mounting method is by the use of conductive epoxy following the manufacturer’s recommended curing temperature. For eutectic 80/20 gold/tin solder, use a stage temperature of 280-300°C for a maximum time of 60s. Use forming gas (90%N2, 10% H2) for best results. Recommended lead bond technique is thermocompression wedge bonding with 25µm diameter wire. The bond tool force shall be 35-38g. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended. HANDLING PRECAUTIONS: To avoid damage to the be exercised during handling. Proper should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 0 (0-250 V) as defined in JEDEC Standard No. 22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL- HDBK-263. devices care should Electrostatic Discharge (ESD) precautions PPLICATION NOTES & DESIGN DATA: pplication Notes and design data including S- ISCLAIMERS : his product is not designed for use in any RDERING INFORMATION: A A parameters are available on request D T space based or life sustaining/supporting equipment. O PART NUMBER DESCRIPTION FMA219 Die Input and output thin film substrates with 50 Ω microstrip transmission lines. Substrate thickness 250 µm or thinner is recommended. 75 µm nominal gap on each side 250 µm Au ribbon recommended 150pF capacitor 25 µm dia. Au wire (x2) on input and output ports, less than 1000 µm length each Note: The supply de-coupling capacitor (150 pF recommended value) should be placed as close to the MMIC as practical. To +VDD |
Similar Part No. - FMA219_1 |
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Similar Description - FMA219_1 |
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