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L6376 Datasheet(PDF) 6 Page - STMicroelectronics |
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L6376 Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 12 page THERMAL CHARACTERISTICS Rth j-pins DIP16+2+2. The thermal resistance is re- ferred to the thermal path from the dissipat- ing region on the top surface of the silicon chip, to the points along the four central pins of the package, at a distance of 1.5 mm away from the stand-offs. Rth j-amb1 If a dissipating surface, thick at least 35 µm, and with a surface similar or bigger than the one shown, is created making use of the printed circuit. Such heatsinking surface is considered on the bottom side of an horizontal PCB (worst case). Rth j-amb2 If the power dissipating pins (the four central ones), as well as the others, have a mini- mum thermal connection with the external world (very thin strips only) so that the dissi- pation takes place through still air and through the PCB itself. It is the same situation of point above, with- out any heatsinking surface created on pur- pose on the board. Additional data on the PowerDip and the PowerSO20 package can be found in: Application Note AN467: Thermal Characteristics of the PowerDip 20,24 Packages Soldered on 1,2,3 oz. Copper PCB Application Note AN668: A New High Power IC Surface Mount Pack- age: PowerSO20 Power IC Packaging from Insertion to Surface Mounting. THERMAL DATA Symbol Parameter DIP16+2+2 PowerSO20 Unit Rth j-pin Thermal Resistance, Junction to Pin 12 – °C/W Rth j-amb1 Thermal Resistance, Junction to Ambient (see Thermal Characteristics) 40 – °C/W Rth j-amb2 Thermal Resistance, Junction to Ambient (see Thermal Characteristics) 50 – °C/W Rth j-case Thermal Residance Junction-case – 1.5 °C/W Figure 1: Printed Heatsink L6376 6/12 |
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