OPT101

4

SBBS002A

www.ti.com

MOISTURE SENSITIVITY

AND SOLDERING

Clear plastic does not contain the structural-enhancing fillers

used in black plastic molding compound. As a result, clear

plastic is more sensitive to environmental stress than black

plastic. This can cause difficulties if devices have been stored

in high humidity prior to soldering. The rapid heating during

soldering can stress wire bonds and cause failures. Prior to

soldering, it is recommended that plastic devices be baked-out

at +85

°C for 24 hours.

The fire-retardant fillers used in black plastic are not compat-

ible with clear molding compound. The OPT101 plastic

packages cannot meet flammability test, UL-94.

PIN CONFIGURATIONS

Top View

DIP

V

S

–In

–V

1M

Ω Feedback

Common

NC

NC

Output

1

2

3

4

8

7

6

5

(1)

NOTE: (1) Photodiode location.

Output Short-Circuit (to ground) ............................................... Continuous

Operating Temperature .................................................... –25

°C to +85°C

Storage Temperature ........................................................ –25

°C to +85°C

Junction Temperature ...................................................................... +85

°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

(Vapor-Phase Soldering Not Recommended)

NOTE: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those specified is not implied.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper han-

dling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPT101P

DIP-8

NTC

–25

°C to +85°C

OPT101

OPT101P

Rail, 50

OPT101P-J

DTL

–25

°C to +85°C

OPT101

OPT101P-J

Rail, 50

NOTES: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet. (2) 8-pin DIP with J-formed

leads for surface mounting.