ULLGA8, 1.6x1.0, 0.4P

CASE 613AB-01

ISSUE A

DATE 08 FEB 2008

SCALE 8:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

4. A MAXIMUM OF 0.05 PULL BACK OF THE

PLATED TERMINAL FROM THE EDGE OF THE

PACKAGE IS ALLOWED.

A

B

E

D

BOTTOM VIEW

b

e

8X

0.10

B

0.05

A

C

C

L

7X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

8X

A

A1

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

L1

1

4

5

8

1

DIM

MIN

MAX

MILLIMETERS

A

---

0.40

A1

0.00

0.05

b

0.15

0.25

D

1.60 BSC

E

1.00 BSC

e

0.40 BSC

L

0.25

0.35

L1

0.30

0.40

SOLDERMASK DEFINED*

DIMENSIONS: MILLIMETERS

0.26

7X

0.49

8X

1.24

0.53

PITCH

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

e/2

NOTE 4

0.40

1

MOUNTING FOOTPRINT

PKG

OUTLINE

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 - Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON24010D

ON SEMICONDUCTOR STANDARD

ULLGA8, 1.6X1.0, 0.4P

Electronic

versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

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