Specifications are subject to change without notice.

9

NOVEMBER 1995 - REVISED AUGUST 2002

This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will

withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high

humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.

D008 Plastic Small-outline Package

TISP61089 Gated Protector Series

MECHANICAL DATA

NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.

B. Body dimensions do not include mold flash or protrusion.

C. Mold flash or protrusion shall not exceed 0.15 (0.006).

D. Lead tips to be planar within ±0.051 (0.002).

D008

8

765

4

3

2

1

8-pin Small Outline Microelectronic Standard

Package MS-012, JEDEC Publication 95

MDXXAA E

INDEX

4.80 - 5.00

(0.189 - 0.197)

5.80 - 6.20

(0.228 - 0.244)

3.81 - 4.00

(0.150 - 0.157)

1.35 - 1.75

(0.053 - 0.069)

0.102 - 0.203

(0.004 - 0.008)

0.28 - 0.79

(0.011 - 0.031)

0.51 - 1.12

(0.020 - 0.044)

4.60 - 5.21

(0.181 - 0.205)

0.36 - 0.51

(0.014 - 0.020)

0.25 - 0.50

(0.010 - 0.020)

0.190 - 0.229

(0.0075 - 0.0090)

Pin Spacing

1.27

(0.050)

(see Note A)

6 places

x 45 ° N0M

8 Places

7 ° NOM

4 Places

7 ° NOM

3 Places

4 ° ± 4 °

DIMENSIONS ARE:

MILLIMETERS

(INCHES)