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W83176G-732 Datasheet(PDF) 10 Page - Winbond |
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W83176G-732 Datasheet(HTML) 10 Page - Winbond |
10 / 12 page W83176R-732/W83176G-732 2 DIMM DDR ZERO DELAY buffer for Sis chipset Publication Release Date: March, 2006 - 7 - Revision 1.1 9. ORDERING INFORMATION Part Number Package Type Production Flow W83176R-732 28 PIN SSOP Commercial, 0 °C to +70°C W83176G-732 28 PIN SSOP (Lead free package) Commercial, 0 °C to +70°C 10. HOW TO READ THE TOP MARKING W83176R-732 442GB 1st line: Winbond logo and the type number: Normal package: W83176R-732, Lead free package:W83176G-732 2nd line: Tracking code 2 8051234 2: wafers manufactured in Winbond FAB 2 8051234: wafer production series lot number 3rd line: Tracking code 342 G B 442: packages made in '2003, week 42 G: assembly house ID; O means OSE, G means GR B: IC revision All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. 28051234 W83176G-732 442GB 28051234 |
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