1

FEATURES

APPLICATIONS

DRC PACKAGE

(TOP VIEW)

1

2

3

4

5

10

9

8

7

6

NO2

COM2

NC2

IN2

V

+

NO1

COM1

NC1

IN1

GND

DGS PACKAGE

(TOP VIEW)

1

2

3

4

5

10

9

8

7

6

NO2

COM2

NC2

IN2

V

+

NO1

COM1

NC1

IN1

GND

YZP PACKAGE

Laser Marking View

Bump View

B

C

D

3

2

1

A

B

C

D

1

2

3

A

DESCRIPTION/ORDERING INFORMATION

TS5A22362,, TS5A22364

0.65-

Ω DUAL SPDT ANALOG SWITCHES

WITH NEGATIVE SIGNALING CAPABILITY

SCDS261 – MARCH 2008

www.ti.com

• Specified Break-Before-Make Switching

• Negative Signaling Capability: Maximum

• Internal Shunt Switch Prevents Audible

Click-and-Pop When Switching Between Two

Sources (TS5A22364)

• Low ON-State Resistance (0.65 Ω Typical)

• Low Charge Injection

• Excellent ON-State Resistance Matching

• 2.3-V to 5.5-V Power Supply (V

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

–

2500-V Human-Body Model

(A114-B, Class II)

–

1500-V Charged-Device Model (C101)

–

200-V Machine Model (A115-A)

• Cell Phones

• PDAs

• Portable Instrumentation

• Audio Routing

YZP PACKAGE TERMINAL ASSIGNMENTS

D

NO2

NO1

C

COM2

COM1

B

NC2

NC1

A

IN2

GND

IN1

1

2

3

The TS5A22362 and TS5A22364 are single-pole double-throw (SPDT) analog switches designed to operate from

2.3 V to 5.5 V. The devices feature negative signal capability that allows signals below ground to pass through

the switch without distortion. Additionally, the TS5A22364 includes an internal shunt switch, which automatically

discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the

audible click/pop noise when switching between two sources. The break-before-make feature prevents signal

distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent

channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are

ideal for audio applications.

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2008, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.