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3A

3

2

5

8

1

1A

3Y

GND

DCT PACKAGE

(TOP VIEW)

DCU PACKAGE

(TOP VIEW)

3

2

4

5

1

1A

1Y

3Y

GND

3Y

GND

2Y

2A

See mechanical drawings for dimensions.

2

5

3

4

8

2A

3A

2Y

2A

1Y

2Y

4

6

7

6

7

8

6

1

7

1A

3A

1Y

YZP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC3G07

TRIPLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUTS

SCES365J – AUGUST 2001 – REVISED FEBRUARY 2007

• Available in the Texas Instruments

• Typical V

NanoFree™ Package

V

• Supports 5-V V

• I

Operation

• Max t

• Latch-Up Performance Exceeds 100 mA Per

• Low Power Consumption, 10-µA Max I

CC

JESD 78, Class II

• ±24-mA Output Drive at 3.3 V

• ESD Protection Exceeds JESD 22

• Input and Open-Drain Output Accepts

–

2000-V Human-Body Model (A114-A)

Voltages up to 5.5 V

–

200-V Machine Model (A115-A)

• Typical V

at V

–

1000-V Charged-Device Model (C101)

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement

active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74LVC3G07YZPR

_ _ _CV

0.23-mm Large Bump – YZP (Pb-free)

SSOP – DCT

Reel of 3000

SN74LVC3G07DCTR

C07_ _ _

–40°C to 85°C

Reel of 3000

SN74LVC3G07DCUR

VSSOP – DCU

C07_

Reel of 250

SN74LVC3G07DCUT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.