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LMH6644EP Datasheet(PDF) 6 Page - National Semiconductor (TI) |
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LMH6644EP Datasheet(HTML) 6 Page - National Semiconductor (TI) |
6 / 21 page ±5V Electrical Characteristics (Continued) Note 4: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 5: Human body model, 1.5k Ω in series with 100pF. Note 6: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Note 7: The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD =(TJ(MAX) -TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. Note 8: Typical values represent the most likely parametric norm. Note 9: All limits are guaranteed by testing or statistical analysis. Note 10: Positive current corresponds to current flowing into the device. Note 11: Slew rate is the average of the rising and falling slew rates. Note 12: Machine Model, 0 Ω in series with 200pF. Note 13: Short circuit test is a momentary test. See Note 14. Note 14: Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. Note 15: Offset voltage average drift determined by dividing the change in VOS at temperature extremes by the total temperature change. Connection Diagrams SOT23-5 (LMH6642) SOIC-8 (LMH6642) SOIC-8 and MSOP-8 (LMH6643) 20089461 Top View 20089462 Top View 20089463 Top View SOIC-14 and TSSOP-14 (LMH6644) 20089468 Top View www.national.com 6 |
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