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M36W108B120ZM5T Datasheet(PDF) 4 Page - STMicroelectronics

Part # M36W108B120ZM5T
Description  8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

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Reset Input (RP). The
Reset
input
provides
hardware reset of the Flash chip. Reset of the
Flash memory is achieved by pulling RP to VIL for
at least tPLPX. When the reset pulse is given, if the
Flash memory is in Read or Standby modes, it will
be available for new operations in tPHEL after the
rising edge of RP.
If the Flash memory is in Erase or Program mode
the reset will take tPLYH during which the Ready/
Busy (RB) signal will be held at VIL. The end of the
Flash memory reset will be indicated by the rising
edge of RB. A hardware reset during an Erase or
Program operation will corrupt the data being pro-
grammed or the block(s) being erased. See Table
17 and Figure 9.
Ready/Busy Output (RB). Ready/Busy
is
an
open-drain output of the Flash chip. It gives the in-
ternal state of the Program/Erase Controller (P/
E.C.) of the Flash device. When RB is Low, the
Flash device is busy with a Program or Erase op-
eration and it will not accept any additional pro-
gram or erase instructions except the Erase
Suspend instruction. When RB is High, the Flash
device is ready for any Read, Program or Erase
operation. The RB will also be High when the
Flash memory is put in Erase Suspend or Standby
modes.
VCCF Supply Voltage. Flash memory power sup-
ply for all operations (Read, Program and Erase).
VCCS Supply Voltage. SRAM power supply for
all operations (Read, Program).
VSS Ground. VSS is the reference for all voltage
measurements.
POWER SUPPLY
Power Up. The Flash memory Command Inter-
face is reset on power up to Read Array. Either
Flash Chip Enable (EF) or Write Enable (W) inputs
must be tied to VIH during Power Up to allow max-
imum security and the possibility to write a com-
mand on the first rising edge of EF and W. Any
write cycle initiation is blocked when VCCF is below
VLKO.
Supply Rails. Normal precautions must be taken
for supply voltage decoupling; each device in a
system should have the VCCF, VCCS rails decou-
pled with a 0.1µF capacitor close to the VCCF,
VCCS and VSS pins. The PCB trace widths should
be sufficient to carry the VCCF and VCCS program
currents and the VCCF erase current required.
Table 3. Main Operation Modes (1)
Note: 1. X = VIL or VIH.
Operation Mode
EF
E1S
E2S
G
W
RP
DQ0-DQ7
Flash Chip Read
VIL
VIH
X
VIL
VIH
VIH
Data Output
VIL
X
VIL
VIL
VIH
VIH
Data Output
SRAM Chip Read
VIH
VIL
VIH
VIL
VIH
X
Data Output
Flash Chip Write
VIL
VIH
X
VIH
VIL
VIH
Data Input
VIL
X
VIL
VIH
VIL
VIH
Data Input
SRAM Chip Write
VIH
VIL
VIH
X
VIL
X
Data Input
Flash Chip Output Disable
X
VIH
X
VIH
VIH
XHi-Z
XX
VIL
VIH
VIH
XHi-Z
SRAM Chip Output Disable
VIH
VIL
VIH
VIH
VIH
XHi-Z
Flash Chip Stand-by
VIH
XX
XX
VIH
Hi-Z
Flash Chip Reset
X
VIH
XX
X
VIL
Hi-Z
XX
VIL
XX
VIL
Hi-Z
SRAM Chip Stand-by
X
VIH
XX
X
VIL
Hi-Z
XX
VIL
XX
VIL
Hi-Z


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