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SN74LVC1G06

SINGLE INVERTER BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES295T – JUNE 2000 – REVISED JANUARY 2007

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74LVC1G06YZPR

_ _ _CT_

0.23-mm Large Bump – YZP (Pb-free)

NanoFree™ – WCSP (DSBGA)

_ _ _ _

Reel of 3000

SN74LVC1G06YZVR

0.23-mm Large Bump – YZV (Pb-free)

CT

Reel of 3000

SN74LVC1G06DBVR

–40

°C to 85°C SOT (SOT-23) – DBV

C06_

Reel of 250

SN74LVC1G06DBVT

Reel of 3000

SN74LVC1G06DCKR

SOT (SC-70) – DCK

CT_

Reel of 250

SN74LVC1G06DCKT

SOT (SOT-553) – DRL

Reel of 4000

SN74LVC1G06DRLR

CT_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2

has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

FUNCTION TABLE

INPUT

OUTPUT

A

Y

H

L

L

H

LOGIC DIAGRAM (POSITIVE LOGIC)

(DBV, DCK, DRL, YZP PACKAGE)

LOGIC DIAGRAM (POSITIVE LOGIC)

(YZV PACKAGE)

2

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