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DISSIPATION RATINGS

THERMAL CHARACTERISTICS

RECOMMENDED OPERATING CONDITIONS

SN75DP122

SLLS892 – FEBRUARY 2008

PCB JEDEC

PACKAGE

STANDARD

POWER RATING

Low-K

3623 mW

36.23 mW/

°C

1449 mW

56-Pin QFN (RTQ)

High-K

1109 mW

11.03 mW/

°C

443.9 mW

(1)

This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

UNIT

Junction-to-board thermal

4x4 Thermal vias under powerpad

11.03

°C/W

resistance

Junction-to-case thermal

20.4

C/W

resistance

Device power dissipation

250

305

mW

DisplayPort selected

DD

Device power dissipation TMDS

270

420

mW

selected

DD

Device power dissipation under

75

85

µW

low power

DD

(1)

The maximum rating is simulated under 5.25 V VDD.

MIN

NOM

MAX

UNIT

Supply voltage

4.5

5

5.25

V

*1

HPD and CAD output reference voltage

1.62

5.25

V

Supply voltage

3

3.3

3.6

V

Operating free-air temperature

0

85

°C

MAIN LINK DIFFERENTIAL PINS

Peak-to-peak input differential voltage

0.15

1.40

V

Data rate

2.7

Gbps

Termination resistance

45

50

55

Ω

Output termination voltage

0

2

V

TMDS DIFFERENTIAL OUTPUT PINS

TMDS output termination voltage

3

3.3

3.6

V

Data rate

2.5

Gbps

Termination resistance

45

50

55

Ω

Input voltage

0

5.25

V

Auxiliary data rate

1

MHz

100

kHz

HPD, CAD, AND CONTROL PINS

High-level input voltage

2

5.25

V

Low-level input voltage

0

0.8

V

6

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