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PACKAGE CHARACTERISTICS

(1)

IEC SAFETY LIMITING VALUES

IEC 61000-4-5 RATINGS

IEC 60664-1 RATINGS

AMC1203

SBAS427 – FEBRUARY 2008

Over recommended operating conditions, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Shortest terminal to terminal distance

L(I01)

Minimum air gap (clearance)

7.0

mm

through air

Shortest terminal to terminal distance

L(I02)

Minimum external tracking (creepage)

7.0

mm

across the package surface

Tracking resistance (comparative

CTI

DIN IEC 60112 / VDE 0303 Part 1

≥ 175

V

tracking index)

Minimum internal gap (internal

Distance through the insulation

0.008

mm

clearance)

each side of the barrier tied together

Ω

Isolation resistance

Ω

+100

°C ≤ T

Barrier capacitance input to output

1.2

pF

Input capacitance to ground

3

pF

(1)

Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care

should be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the isolator

on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to

the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit

board are used to help increase these specifications.

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A

failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient

power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.

The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings

table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware

determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is

that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction

temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Safety input, output, or supply current

θ

90

mA

Maximum case temperature

+150

°C

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Surge immunity

1.2/50

µs voltage surge and 8/20µs current surge

±6000

V

PARAMETER

TEST CONDITIONS

SPECIFICATION

Basic isolation group

Material group

IIIa

Rated mains voltage

I-IV

Installation classification

I-III

4

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