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EMIF06-AUD01F2 Datasheet(PDF) 11 Page - STMicroelectronics |
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EMIF06-AUD01F2 Datasheet(HTML) 11 Page - STMicroelectronics |
11 / 14 page EMIF06-AUD01F2 Ordering information scheme 11/14 3 Ordering information scheme Figure 29. Ordering information scheme 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 30. Flip chip dimensions EMIF yy - xxx zz Fx EMI Filter Number of lines Information Package 3 letters = application 2 digits = version F = Flip-Chip x = 2: Lead free, pitch = 500 µm, bump = 315 µm 2.42 mm ± 50 µm 315 µm ± 50 500 µm ± 50 650 µm ± 65 |
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