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STMPE821 Datasheet(PDF) 50 Page - STMicroelectronics |
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STMPE821 Datasheet(HTML) 50 Page - STMicroelectronics |
50 / 55 page Package mechanical data STMPE821 50/55 13 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 13. QFN16L (2.6 x 1.8 mm) package outline 1. Drawing not to scale. 2. Dimensions are in millimeters. BOTTOM VIEW QFN16L |
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