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STR73XFXX Datasheet(PDF) 47 Page - STMicroelectronics |
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STR73XFXX Datasheet(HTML) 47 Page - STMicroelectronics |
47 / 52 page STR73xFxx Package characteristics 47/52 Figure 26. 144-ball low profile fine pitch ball grid array package Figure 27. Recommended PCB design rules (0.80/0.75mm pitch BGA) Dim. mm inches1) Min Typ Max Min Typ Max A 1.21 1.70 0.0476 0.0669 A1 0.21 0.0083 A2 1.085 0.0427 b 0.35 0.40 0.45 0.0138 0.0157 0.0177 D 9.85 10.00 10.15 0.3878 0.3937 0.3996 D1 8.80 0.3465 E 9.85 10.00 10.15 0.3878 0.3937 0.3996 E1 8.80 0.3465 e 0.80 0.0315 F 0.60 0.0236 ddd 0.10 0.0039 eee 0.15 0.0059 fff 0.08 0.0031 Number of Pins N 144 1Values in inches are converted from mm and rounded to 4 decimal digits. Dpad Dsm Dpad 0.37 mm Dsm 0.52 mm typ. (depends on solder mask registration tolerance Solder paste 0.37 mm aperture diameter – Non solder mask defined pads are recommended – 4 to 6 mils screen print |
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