MANUFACTURER

CATEGORY

SERIES

PACKAGE

VOLTAGE

CLASS

REV

ECLIPTEK CORP.

OSCILLATOR

EMK23

PLASTIC

3.3V

OS5L

11/07

MECHANICAL DIMENSIONS

ALL DIMENSIONS IN MILLIMETERS

ENVIRONMENTAL/MECHANICAL SPECIFICATIONS

TAPE AND REEL DIMENSIONS

ALL DIMENSIONS IN MILLIMETERS

SUGGESTED SOLDER PAD LAYOUT

ALL DIMENSIONS IN MILLIMETERS

800-ECLIPTEK www.ecliptek.com for latest revision

Specifications subject to change without notice.

EMK23 H 2 H - 50.000M TR

PART NUMBERING GUIDE

AVAILABLE OPTIONS

Blank=Bulk

TR=Tape and Reel (Standard)

FREQUENCY

FREQUENCY TOLERANCE & STABILITY/

OPERATING TEMPERATURE RANGE

G=±100ppm Maximum over -40°C to +85°C

H=±50ppm Maximum over -40°C to +85°C

DUTY CYCLE

2=50% ±5%

LOGIC CONTROL

H=Tri-State (High Impedance)

J=Power Down (Logic Low)

*Compliant to EIA 481C

Tolerances= +0.1

Pin 1: Tri-State or Power Down

Pin 2: Case Ground

Pin 3: Output

Pin 4: Supply Voltage

1.60

(x4)

1.50

(x4)

0.60

1.04

A

B

C

D

E

F

12.0 ±0.2

5.5 ±0.1

6.5 ±0.1

4.0 ±0.1

2.0 ±0.1

F

G

H

J

K

L

8.0 ±0.2

A0*

1.5+0.1/-0

B0* 0.30 ±0.05

K0*

TAPE

M

N

O

P

Q

1.5 MIN

50 MIN

20.2 MIN 13.0 ±0.2

40 MIN

R

S

T

U

V

QTY/REEL

2.5 MIN

10 MIN

18.4 MAX

180 MAX

12.4 +2/-0

1,000

REEL

MEMS First™ is a registered trademark of SiTime Corporation.

MARKING SPECIFICATIONS

Line 1: XXXX

Ecliptek Manufacturing Lot Code

Characteristic

Specification

ESD Susceptibility

MIL-STD-883, Method 3015, Class

2, HBM: 2000V

Flammability

UL94-V0

Mechanical Shock

MIL-STD-883, Method 2002, Condition G, 30,000G

Moisture Resistance

MIL-STD-883, Method 1004

Moisture Sensitivity Level

J-STD-020, MSL 1

Resistance to Soldering Heat

MIL-STD-202, Method 210, Condition K

Resistance to Solvents

MIL-STD-202, Method 215

Solderability

MIL-STD-883, Method 2003 (Four I/O Pads on

bottom of package only)

Temperature Cycling

MIL-STD-883, Method 1010, Condition B

Thermal Shock

MIL-STD-883, Method 1011, Condition B

Vibration

MIL-STD-883, Method 2007, Condition A, 20G

3.20

±0.15

0.85

±0.15

0.08

MAX

2.39

±0.10

0.20 ±0.10

1.15

±0.10

(x4)

1.20 ±0.10 (x4)

5.00

±0.15

0.80 ±0.15

2

1

3

4

R0.58

±0.10

*Solder connection to the bottom pads of the package only.

C0.35

±0.10