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EMK31G2H-50000M Datasheet(PDF) 2 Page - Ecliptek Corporation |
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EMK31G2H-50000M Datasheet(HTML) 2 Page - Ecliptek Corporation |
2 / 2 page MANUFACTURER CATEGORY SERIES PACKAGE VOLTAGE CLASS REV .DATE ECLIPTEK CORP. OSCILLATOR EMK31 PLASTIC 1.8V OS5K 11/07 MECHANICAL DIMENSIONS ALL DIMENSIONS IN MILLIMETERS ENVIRONMENTAL/MECHANICAL SPECIFICATIONS TAPE AND REEL DIMENSIONS ALL DIMENSIONS IN MILLIMETERS SUGGESTED SOLDER PAD LAYOUT ALL DIMENSIONS IN MILLIMETERS 800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice. EMK31 H 2 H - 50.000M TR PART NUMBERING GUIDE AVAILABLE OPTIONS Blank=Bulk TR=Tape and Reel (Standard) FREQUENCY FREQUENCY TOLERANCE & STABILITY/ OPERATING TEMPERATURE RANGE G=±100ppm Maximum over -40°C to +85°C H=±50ppm Maximum over -40°C to +85°C DUTY CYCLE 2=50% ±5% LOGIC CONTROL H=Tri-State (High Impedance) J=Power Down (Logic Low) *Compliant to EIA 481C Tolerances= +0.1 Pin 1: Tri-State or Power Down Pin 2: Case Ground Pin 3: Output Pin 4: Supply Voltage 1.20 (x4) 1.40 (x4) 0.50 0.80 2.50 ±0.15 0.85 ±0.15 0.08 MAX 2.10 ±0.10 0.20 ±0.10 0.90 ±0.10 (x4) 0.80 ±0.10 (x4) 3.20 ±0.15 R0.45 ±0.10 2 1 3 4 0.90 ±0.15 R0.35 ±0.10 *Solder connection to the bottom pads of the package only. A B C D E F 12.0 ±0.3 5.5 ±0.05 4.75 ±.05 4.0 ±0.1 2.0 ±0.1 F G H J K L 4.0 ±0.2 A0* 1.5 +.1/-0 B0* 0.3 ±0.05 K0* REEL PLASTIC MEMS First™ is a registered trademark of SiTime Corporation. MARKING SPECIFICATIONS M N O P Q 1.5 MIN 50 MIN 20.2 MIN 13.0 ±0.2 40 MIN R S T U V QTY/REEL 2.5 MIN 10 MIN 18.4 MAX 180 MAX 12.4 +2/-0 1,000 Line 1: XXXX Ecliptek Manufacturing Lot Code Characteristic Specification ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM: 2000V Flammability UL94-V0 Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity Level J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only) Temperature Cycling MIL-STD-883, Method 1010, Condition B Thermal Shock MIL-STD-883, Method 1011, Condition B Vibration MIL-STD-883, Method 2007, Condition A, 20G |
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