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LMC7221BIM Datasheet(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # LMC7221BIM
Description  Tiny CMOS Comparator with Rail-To-Rail Input and Open Drain Output
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LMC7221BIM Datasheet(HTML) 4 Page - National Semiconductor (TI)

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AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
J = 25˚C, V
+ = 5V, V= 0V, V
CM =VO =V
+/2. Boldface limits apply at
the temperature extreme.
Typ
LMC7221AI
LMC7221BI
Symbol
Parameter
Conditions
(Note 5)
Limit
Limit
Units
(Note 6)
(Note 6)
t
rise
Rise Time
f = 10 kHz, C
L = 50 pF, (Note 8)
0.3
µs
Overdrive = 10 mV, 5 k
Ω Pullup
t
fall
Fall Time
f = 10 kHz, C
L = 50 pF, (Note 8)
0.3
µs
Overdrive = 10 mV, 5 k
Ω Pullup
t
PHL
Propagation Delay
(High to Low) (Note 10)
f = 10 kHz, C
L =50pF,
5k
Ω Pullup (Note 8)
10 mV
10
µs
100 mV
4
V
+ = 2.7V,f=10 kHz,
C
L =50pF,5k
Ω Pullup
(Note 8)
10 mV
10
µs
100 mV
4
t
PLH
Propagation Delay
(Low to High) (Note 10)
f = 10 kHz, C
L =50pF,
5k
Ω Pullup (Note 8)
10 mV
6
µs
100 mV
4
V
+ = 2.7V,f=10 kHz,
C
L =50pF,5k
Ω Pullup
(Note 8)
10 mV
7
µs
100 mV
4
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C. Output currents in excess of ±30 mA may adversely affect reliability.
Note 4: The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD =(TJ(MAX) –TA)/
θJA. All numbers apply for packages soldered directly onto a PC Board.
Note 5: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Limiting input pin current is only necessary for input voltages which exceed the absolute maximum input voltage rating.
Note 8: Do not short circuit the output to V+ when V+ is greater than 12V or reliability will be adversely affected.
Note 9: CL includes the probe and test jig capacitance.
Note 10: Input offset voltage average drift is calculated by dividing the accelerated operating life VOS drift by the equivalent operational time. This represents worst
case input conditions and includes the first 30 days of drift.
Note 11: Input step voltage for propagation delay measurement is 2V.
www.national.com
4


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