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EMIF03-SIM02M8 Datasheet(PDF) 8 Page - STMicroelectronics |
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EMIF03-SIM02M8 Datasheet(HTML) 8 Page - STMicroelectronics |
8 / 10 page Recommendation on PCB assembly EMIF03-SIM02M8 8/10 5.3 Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5.4 PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 5.5 Reflow profile Figure 17. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement. 0 01 2345 67 Time (min) Temperature (°C) 2°C/s recommended 6°C/s max 220°C 125 °C 260°C max 255°C 180°C 90 sec max 10-30 sec 90 to 150 sec 3°C/s max 0 01 2345 67 Time (min) Temperature (°C) 2°C/s recommended 6°C/s max 220°C 125 °C 260°C max 255°C 180°C 90 sec max 10-30 sec 90 to 150 sec 3°C/s max |
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