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EMIF04-1005M8 Datasheet(PDF) 8 Page - STMicroelectronics |
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EMIF04-1005M8 Datasheet(HTML) 8 Page - STMicroelectronics |
8 / 10 page Recommendation on PCB assembly EMIF04-1005M8 8/10 4.5 Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement. 0 01 2345 67 Time (min) Temperature (°C) 2°C/s recommended 6°C/s max 220°C 125 °C 260°C max 255°C 180°C 90 sec max 10-30 sec 90 to 150 sec 3°C/s max 0 01 2345 67 Time (min) Temperature (°C) 2°C/s recommended 6°C/s max 220°C 125 °C 260°C max 255°C 180°C 90 sec max 10-30 sec 90 to 150 sec 3°C/s max |
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