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LC4256C-75FTN256BC Datasheet(PDF) 42 Page - Lattice Semiconductor

Part # LC4256C-75FTN256BC
Description  3.3V/2.5V/1.8V In-System Programmable SuperFAST High Density PLDs
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Manufacturer  LATTICE [Lattice Semiconductor]
Direct Link  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

LC4256C-75FTN256BC Datasheet(HTML) 42 Page - Lattice Semiconductor

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Lattice Semiconductor
ispMACH 4000V/B/C/Z Family Data Sheet
42
Signal Descriptions
ispMACH 4000V/B/C ORP Reference Table
ispMACH 4000Z ORP Reference Table
Signal Names
Description
TMS
Input – This pin is the IEEE 1149.1 Test Mode Select input, which is used to control
the state machine.
TCK
Input – This pin is the IEEE 1149.1 Test Clock input pin, used to clock through the
state machine.
TDI
Input – This pin is the IEEE 1149.1 Test Data In pin, used to load data.
TDO
Output – This pin is the IEEE 1149.1 Test Data Out pin used to shift data out.
GOE0/IO, GOE1/IO
These pins are configured to be either Global Output Enable Input or as general I/O
pins.
GND
Ground
NC
Not Connected
VCC
The power supply pins for logic core and JTAG port.
CLK0/I, CLK1/I, CLK2/I, CLK3/I
These pins are configured to be either CLK input or as an input.
VCCO0, VCCO1
The power supply pins for each I/O bank.
yzz
Input/Output
1 – These are the general purpose I/O used by the logic array. y is GLB
reference (alpha) and z is macrocell reference (numeric). z: 0-15.
ispMACH 4032
y: A-B
ispMACH 4064
y: A-D
ispMACH 4128
y: A-H
ispMACH 4256
y: A-P
ispMACH 4384
y: A-P, AX-HX
ispMACH 4512
y: A-P, AX-PX
1. In some packages, certain I/Os are only available for use as inputs. See the signal connections table for details.
4032V/B/C
4064V/B/C
4128V/B/C
4256V/B/C
4384V/B/C
4512V/B/C
Number of I/Os
30
1
32
30
2
32
64
64
92
3
96
64
96
4
128
160
128
192
128
208
Number of GLBs
2
2
4
4
4
8
8
8
16
16
16
16
16
16
16
16
Number of I/Os /
GLB
16
16
8
8
16
8
12
12
4
8
8
10
8
8
8
Mixture
of 8 & 4
5
Reference ORP
Table
16 I/Os /
GLB
8 I/Os /
GLB
16 I/Os /
GLB
8 I/Os /
GLB
12 I/Os /
GLB
4 I/Os /
GLB
8 I/Os /
GLB
8 I/Os /
GLB
10 I/Os /
GLB
8 I/Os /
GLB
8 I/Os /
GLB
8 I/Os /
GLB
4 I/Os /
GLB
1. 32-macrocell device, 44 TQFP: 2 GLBs have 15 out of 16 I/Os bonded out.
2. 64-macrocells device, 44 TQFP: 2 GLBs have 7 out of 8 I/Os bonded out.
3. 128-macrocell device, 128 TQFP: 4 GLBs have 11 out of 12 I/Os
4. 256-macrocell device, 144 TQFP: 16 GLBs have 6 I/Os per
5. 512-macrocell device: 20 GLBs have 8 I/Os per, 12 GLBs have 4 I/Os per
4032Z
4064Z
4128Z
4256Z
Number of I/Os
32
32
64
64
96
64
96
1
128
Number of GLBs
24488
16
16
16
Number of I/Os / GLB
16
8
16
8
12
4
8
8
Reference ORP Table
16 I/Os /
GLB
8 I/Os /
GLB
16 I/Os /
GLB
8 I/Os /
GLB
12 I/Os /
GLB
4 I/Os /
GLB
8 I/Os /
GLB
8 I/Os /
GLB
1. 256-macrocell device, 132 csBGA: 16 GLBs have 6 I/Os per


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