© 2007 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN3223 / FAN3224 / FAN3225 • Rev. 1.0.5

2

Ordering Information

Part Number

Logic

Input

Threshold

Package

Packing

Method

Quantity

per Reel

FAN3223CMPX

3x3mm MLP-8

Tape & Reel

3,000

FAN3223CMX

CMOS

SOIC-8

Tape & Reel

2,500

FAN3223TMPX

3x3mm MLP-8

Tape & Reel

3,000

FAN3223TMX

Dual Inverting Channels + Dual Enable

TTL

SOIC-8

Tape & Reel

2,500

FAN3224CMPX

3x3mm MLP-8

Tape & Reel

3,000

FAN3224CMX

CMOS

SOIC-8

Tape & Reel

2,500

FAN3224TMPX

3x3mm MLP-8

Tape & Reel

3,000

FAN3224TMX

Dual Non-Inverting Channels + Dual

Enable

TTL

SOIC-8

Tape & Reel

2,500

FAN3225CMPX

3x3mm MLP-8

Tape & Reel

3,000

FAN3225CMX

CMOS

SOIC-8

Tape & Reel

2,500

FAN3225TMPX

3x3mm MLP-8

Tape & Reel

3,000

FAN3225TMX

Dual Channels of Two-Input / One-

Output Drivers

TTL

SOIC-8

Tape & Reel

2,500

All standard Fairchild Semiconductor products are RoHS compliant and many are also “GREEN” or going green. For Fairchild’s

Package Outlines

Figure 2. 3x3mm MLP-8 (Top View)

Figure 3. SOIC-8 (Top View)

Thermal Characteristics

(1)

Package

(2)

(3)

(4)

(5)

(6)

Units

8-Lead 3x3mm Molded Leadless Package (MLP)

1.2

64

42

2.8

0.7

°C/W

8-Pin Small Outline Integrated Circuit (SOIC)

38

29

87

41

2.3

°C/W

Notes:

1.

Estimates derived from thermal simulation; actual values depend on the application.

2.

Theta_JL (

thermal pad) that are typically soldered to a PCB.

3.

Theta_JT (

held at a uniform temperature by a top-side heatsink.

4.

The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and

JESD51-7, as appropriate.

5.

Psi_JB (

application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board

reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the

SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.

6.

Psi_JT (

the center of the top of the package for the thermal environment defined in Note 4.